New Product News
Dynamic Hybrids, Inc. Your Hybrid Circuit Contract Manufacturer of Hybrid Integrated Circuits Announces:
Direct Bond Copper and Thick Film Copper
DHI's new Direct Bond Copper hybrid circuit technology provides
high power, better thermal management, and greater power handling capabilities.
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Direct Bonding and Thick Films
By Terry J. Barber, Dynamic Hybrids, Inc., Syracuse, NY
Direct Bond Copper (DBC) has traditionally been the province of a
few large companies. This process involves bonding highly conductive
copper foils directly to substrates, and is especially useful for
manufacturing packages with high power-handling capability.
Substrates used are most commonly ceramic, alumina, and beryllia,
which all have excellent high-temperature characteristics.
Suppliers who have a limited scope, catering to a specific service
or single venture, cannot be competitive in today's market. Buyers
are cautious, and companies in general are seeking to keep their
manufacturing costs as low as possible. Many of them are looking to
outsourcing as a viable option. Whether outsourcing or procuring
product, it is important to partner with a subcontractor that can
supply a wide range of products and capabilities as well as being
responsive to the buyer's requirements, coupled with the experience
and technology that is needed.
Controlling the manufacturing environment from start to finish
becomes possible with this marriage of direct bond copper and thick
film all under one roof.
While the DBC market has so long been handled by larger firms, thick
film printing has been produced by smaller independent companies.
One company, Dynamic Hybrids, Inc. (DHI), has broken this /status
quo/ by combining the benefits of DBC for a conductor base or heat
sink, and the ability to screen print thick film pastes to form
passive, conductive, resistive, or insulating circuit elements. With
the ability to control environment, thick film copper can be
incorporated along with these elements. This only heightens surface
Thick film, including copper, engineering capabilities, and now DBC,
top off this well rounded company that has the idea in mind that,
"dynamite comes in small packages." One benefit of circuit boards
made from the rigid substrates of ceramic and alumina is that they
can operate under more power and withstand a much higher
temperature. Power dissipation of any device is limited by the
medium to which it is mounted. This is critical for surface mount
and chip devices. When the mounting medium is fiberglass (FR4), the
boards have poor thermal conductivity. This causes higher component
temperatures, and therefore increased reliability issues. DBC can
take the power load with the ceramic/alumina as the insulating
element. By utilizing thick film and/or DBC technology on ceramic it
becomes possible to increase the circuit's ability to dissipate
power dramatically. This type of substrate and circuit creation
becomes especially attractive if a circuit design has suffered from
heat-related component failure. It also provides a ready solution in
situations where SMT board designs have been limited because of
Multilayers on Ceramic
Multilayer copper traces thicker than 3 oz. are also difficult to
achieve with a fiberglass board. DHI utilizes a minimum of three or
more layers of dielectric between conductive layers, depending on
application requirements. With today's substrates, DBC circuits can
be printed that have as many as 10 conductor layers. Screen-printed
resistors can be multilayered and laser trimmed from 10 ohms to 10
Megohms with less than 0.1 percent tolerances, and higher values can
be achieved using special processes. Capacitors can also be
multilayered and laser trimmed.
DBC can be double-sided and use feedthroughs for interconnection.
Holes in the ceramic can either be utilized to attach
power-generating components for the current-carrying ability or
ground connections directly to the DBC. The holes can also be used
for attaching to a heat sink. Wraparounds to meet the board
designer's requirements are also available. This is especially
helpful when there are real estate issues or shielding problems due
to adjacent high-frequency interference.
In another area, meeting the special needs of operating in harsh
environments can also be handled by DBC. In fact direct bonding is
an especially appropriate technology to use in the manufacture of a
hermetic package designed to operate in harsh environments.
Off-hanging leads for input/output and pin connectors to the next
higher assembly can be integrated in the design with no additional
lead frames needed.
Combining these technologies is not only convenient for the
customer, it also cuts costs and minimizes the conflicts of
different processes used between companies.
There are three classes of DBC available, which can be etched in a
heat-spreading pattern. Electroless plating atop the DBC is always
an option that provides a solution to potential problems with
oxidization when wire bonding and soldering. The sizes are as
diversified as the applications, with the largest thick film
printing size being 6 x 6-in., and the largest DBC size 3 x 5-in.,
and up to 12 mils thick. Combining these technologies is not only
convenient for the customer, it also cuts costs and minimizes the
conflicts of different processes used between companies. Shipping no
longer involves a complex process of fragile pieces shuttling
between companies ? a procedure that can be both time-consuming and
expensive. The process also can fit readily into each company's
schedule, meeting difficult-to-impossible deadlines.
Dynamic Hybrids, Inc., founded in 1992, provides engineering and
management people with many years of experience in the hybrid
circuit industry. The company is well known as a high-quality,
low-cost source for hybrids. While it has primarily been a
thick-film gold, silver, and copper manufacturer, DHI now offers
direct bond copper technology, wirebonding, seam/seal welding, and
solder assembly reflow ? and this can all be in combination for a
truly problem-solving hybrid product. Approximately 60 percent of
the company's output is directed to the military sector, a fact that
attests to the products' inherent reliability. Products range from
high reliability microwave/radar applications to high volume
commercial products. In addition, DHI offers design support options
utilizing internal CAD design techniques, and the company is
Using the available design and engineering expertise, upgrades can
be implemented more easily when the design and production
development issues are already to the engineers. This experience
comes through for modifications of preexisting designs.
Facilities include state-of-the-art test equipment such as x-ray
inspection to assure QC for Medical, Fiberoptic, Microwave, Military
and Surface Mount Device assemblies. The company can create
specialty designs and meet military applications, all including
assembly as well as providing a variety of wirebonding and packaging
capabilities to meet virtually any problem-solving hybrid need.
For more information, contact:
Dynamic Hybrids, Inc.,
1201 E. Fayette St,
Syracuse, NY 13210.
Tel: 315-426-8110; Fax: 315-475-8460.
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Copyright 1998, 2010 [Dynamic Hybrids, Inc.]