Hybrids, Inc. Your preferred choice for turnkey contract manufacturing
of hybrid integrated circuits. DHI has all the process and equipment
capabilities for your requirement. DHI can convert your FR4 board designs to high temperature ceramic. We do FR4 to ceramic conversion frequently to dramatically improve your products thermal capability.
Hybrid Circuit - a
hybrid circuit is a miniaturized electronic circuit constructed of
individual devices, such as transistors, diodes and passive components
such as resistors, inductors and capacitors. The resistors in a hybrid
circuit can be printed on the ceramic substrate using resistive paste
that is fired at high temperature to desired value. This process cuts
down on the assembly components thus improving reliability and
minimizing real estate required.
miniturization, improved thermal efficiency, high power handling
capability, ceramic substrate creates a high temperature circuit board. DHI can convert FR4 to ceramic designs.
Thick-film printing - gold, silver, and copper
Direct Bond Copper Substrates
Die Attach & Wire Bonding
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