Dynamic Hybrids, Inc. Your preferred choice for turnkey contract manufacturing of hybrid integrated circuits. DHI has all the process and equipment capabilities for your requirement. DHI can convert your FR4 board designs to high temperature ceramic. We do FR4 to ceramic conversion frequently to dramatically improve your products thermal capability.
Hybrid Circuit - a hybrid circuit is a miniaturized electronic circuit constructed of individual devices, such as transistors, diodes and passive components such as resistors, inductors and capacitors. The resistors in a hybrid circuit can be printed on the ceramic substrate using resistive paste that is fired at high temperature to desired value. This process cuts down on the assembly components thus improving reliability and minimizing real estate required.
Benefits - miniturization, improved thermal efficiency, high power handling capability, ceramic substrate creates a high temperature circuit board. DHI can convert FR4 to ceramic designs.
Thick-film printing - gold, silver, and copper
Direct Bond Copper Substrates
Die Attach & Wire Bonding
Seam/Seal Welding
Phone (315) 426-8110 or email
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